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Non-contact wafer transport device - List of Manufacturers, Suppliers, Companies and Products

Non-contact wafer transport device Product List

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Solar cell and solar wafer non-contact transport device

Solar cell and solar wafer non-contact transport device

Solar cell and solar wafer non-contact transport device

The solar cell solar wafers, silicon solar cells, amorphous solar cells, and thin-film solar cell cells are transported non-contact by blowing gas or air. A nozzle is equipped to ensure that the high-speed airflow emitted does not directly collide with the solar cells, and the mechanism prevents damage to the thin, fragile solar cells due to the high-speed airflow. Additionally, the "non-contact transport device for solar cell wafers" uses a small amount of air and is efficient. Furthermore, its structure does not discharge exhaust flow into the surrounding environment, thus preventing pollution.

  • Other semiconductor manufacturing equipment
  • Other environmental equipment
  • Packaging materials

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Ultra-thin wafer non-contact transport device

Ultra-thin wafer non-contact transport device

Transport ultra-thin wafers with a thickness of 20μm by bending, warping, and without damage in a non-contact manner.

TAIKO wafers, ultra-thin wafers with a thickness of 20μm, and compound semiconductor wafers can be suspended and transported non-contact without damage. It does not cause stress on the wafers. Wafers with warping can also be suspended and transported non-contact without damage. The air consumption is very low, making it economical.

  • Other semiconductor manufacturing equipment
  • Wafer
  • Semiconductor inspection/test equipment

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Non-contact transport device for sapphire substrate wafers "Float Chuck WAS" type

Non-contact transport device for sapphire substrate wafers "Float Chuck WAS" type

A Bernoulli chuck equipped with an exhaust recovery mechanism that reduces exhaust to the clean room, suitable for use in a clean room with a positioning mechanism.

1. Exhaust Recovery Mechanism: The cleanroom-compatible Bernoulli chuck "Float Chuck WAS type" is composed of an operating surface facing the wafer being held, a cushion chamber provided at the center of the operating surface, a nozzle located at the center of the cushion chamber, and a hood around the outer periphery of the operating surface. The high-speed air flow ejected from the nozzle flows into the gap between the operating surface and the wafer without contacting the walls of the cushion chamber or the wafer. The amount of negative pressure generated by the ejector effect in the cushion chamber also increases, allowing for efficient negative pressure generation. The exhaust air that passes through the gap between the operating surface and the wafer is captured by the surrounding hood and is drawn out through the exhaust port to a designated location. As a result, the high-speed air jet rarely flows into the cleanroom, preventing the discharge of debris and the lifting of dust. 2. Positioning Mechanism: The guide attached to the "Float Chuck WAS type" has a shape at the bottom end that contacts the outer peripheral touchable part of the held wafer, which regulates the free movement of the wafer. Therefore, positioning is possible even though the wafer is held non-contact.

  • Other semiconductor manufacturing equipment

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Non-contact transport device for compound semiconductor wafers "SAG (InP) type"

Non-contact transport device for compound semiconductor wafers "SAG (InP) type"

The compound semiconductor wafers (GaAs, InP, GaP) are supplied through gas operation, and the wafers are non-contact suctioned and detached at a specified position.

◎Features 1. Non-contact transport of wafers at high temperatures of 450°C is possible. 2. Non-contact transport of the following notched compound semiconductor wafers (GaAs, InP, GaP) is possible. - Φ2 to 4 inch wafers - Φ2 to 4 inch x 1/4 wafers - Φ2 to 4 inch x 1/2 wafers

  • Evaporation Equipment
  • Other physicochemical equipment
  • Wafer

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